使用倒装图表或白纸板。

Use a flip chart or white board.

他不仅读过这本书，而且还记得书的内容。(连接两个分句，故倒装。)

Not only did he read the book, but he also remembered what he read.

集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。

Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

提出了无铅印料的配方及性能要求，说明了无铅印料在倒装芯片与表面贴装中的应用。

The essay separately introduced request, realizing approaches and comparison on the pros and cons in accordance with the MES application in SMT.